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Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium : EPITS 2022, 14-15 September, Langkawi, Malaysia - 2023 ed.

By: (Edited by) Dewi Suriyani Che Halin , (Edited by) Kamrosni Abdul Razak , (Edited by) Mohd Arif Anuar Mohd Salleh , (Edited by) Mohd Izrul Izwan Ramli

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Ksh 28,800.00

Format: Hardback or Cased Book

ISBN-10: 9811992665

ISBN-13: 9789811992667

Edition: 2023 ed.

Series: Springer Proceedings in Physics

Publisher: Springer Verlag, Singapore

Imprint: Springer Verlag, Singapore

Country of Manufacture: GB

Country of Publication: GB

Publication Date: Jul 3rd, 2023

Print length: 875 Pages

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This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th  and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ?

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