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Interconnect Reliability in Advanced Memory Device Packaging - 2023 ed.

By: (Author) Huang Chen-Yu , (Author) Gan Chong Leong

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Ksh 32,400.00

Format: Paperback / Softback

ISBN-10: 3031267109

ISBN-13: 9783031267109

Edition: 2023 ed.

Series: Springer Series in Reliability Engineering

Publisher: Springer International Publishing AG

Imprint: Springer International Publishing AG

Country of Manufacture: GB

Country of Publication: GB

Publication Date: Apr 30th, 2024

Print length: 210 Pages

Product Classification: Circuits & components
Computer hardware

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This book explains mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing. In the past 40 years, memory packaging processes have evolved enormously.

Get Interconnect Reliability in Advanced Memory Device Packaging by at the best price and quality guranteed only at Werezi Africa largest book ecommerce store. The book was published by Springer International Publishing AG and it has pages. Enjoy Shopping Best Offers & Deals on books Online from Werezi - Receive at your doorstep - Fast Delivery - Secure mode of Payment

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