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Handbook of Lapping and Polishing

By: (Edited by) Eckart Uhlmann , (Edited by) Ioan D. Marinescu , (Edited by) Toshiro Doi

Manufacture on Demand

Ksh 39,600.00

Format: Hardback or Cased Book

ISBN-10: 1574446703

ISBN-13: 9781574446708

Series: Manufacturing Engineering and Materials Processing

Publisher: Taylor & Francis Inc

Imprint: CRC Press Inc

Country of Manufacture: US

Country of Publication: GB

Publication Date: Nov 20th, 2006

Print length: 508 Pages

Weight: 854 grams

Dimensions (height x width x thickness): 23.70 x 15.90 x 3.40 cms

Product Classification: Metals technology / metallurgy

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Describes the most precise processes available for finishing the surfaces of mechanical as well as electronics and semiconductor components. This book presents an introduction focused on the fundamental concepts and the basics of lapping and polishing processes. It builds on this foundation to discuss lapping of ductile and brittle materials.
Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to bring to the light of day the physical fundamentals and advanced technologies at the leading edge of modern lapping and polishing practice.

Collecting decisive work contributed by industrial and academic experts from the USA, Germany, and Japan, this authoritative resource presents the latest lapping and polishing technologies along with case studies that illustrate their value. After a brief introduction, the book explains the fundamental concepts and major types of lapping and polishing processes. The discussion then turns to lapping of ductile and brittle materials followed by an in-depth look at lapping machines and equipment. Rounding out the presentation, the final chapters discuss polishing technologies and equipment as well as the latest on chemical-mechanical polishing (CMP) and its applications in the semiconductor industry.

Offering an integrated approach to both theory and practical applications under a single cover, the Handbook of Lapping and Polishing supplies a definitive survey of the most advanced surface finishing technologies available.

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